Piezoelectric element
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United States of America Patent
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Jul 7, 2020
Grant Date -
Jan 11, 2018
app pub date -
Jul 3, 2017
filing date -
Jul 7, 2016
priority date (Note) -
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status (Latency Note)
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Abstract
In a piezoelectric element, internal stress generated in an inactive portion at the time of sintering when a piezoelectric element is fabricated or stress applied from the outside to the inactive portion is absorbed by a recess of a lower surface of a first through hole conductor and a recess of an upper surface of a second through hole conductor. Accordingly, for example, deformation, rupture, or the like of the through hole conductor is prevented, and conduction failure or disconnection of an electrode layer or a through hole conductor is prevented. Further, in the inactive portion, since a protrusion of the piezoelectric layer enters the recess of the through hole conductor, a holding force of the piezoelectric layer with respect to the through hole conductor increases, and deformation of the through hole conductor is prevented or obstructed.
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