MEMS component having a high integration density
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United States of America Patent
Stats
-
Jun 9, 2020
Grant Date -
Jan 11, 2018
app pub date -
Dec 18, 2015
filing date -
Feb 27, 2015
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A MEMS component having increased integration density and a method for manufacturing such a component are specified. The component comprises a base wafer and a cover wafer arranged over this. A first cavity is arranged between the base wafer and the cover wafer. A second cavity is arranged over the cover wafer, below a thin-layer covering. The cavities contain component structures.
First Claim
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International Classification(s)
- 2015 Application Filing Year
- H01L Class
- 25498 Applications Filed
- 22451 Patents Issued To-Date
- 88.06 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 1 Citation Count
- H01L Class
- 41.95 % this patent is cited more than
- 5 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Dec 9, 2027 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Dec 9, 2031 |
