Qubit and coupler circuit structures and coupling techniques
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United States of America Patent
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Nov 20, 2018
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Jan 11, 2018
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Nov 3, 2016
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Jul 23, 2015
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Abstract
A cryogenic quantum bit package with multiple qubit circuits facilitates inter-qubit signal propagation using a multi-chip module (MCM). Multiple qubits are grouped within the package into one or more qubit integrated circuits (ICs). The qubit ICs themselves are electrically coupled to each other via a structure including a superconducting MCM and superconducting interconnects. Coupling of quantum electrical signals between a qubit and other qubits, a substrate, or the MCM uses a coupler circuit, such as a Josephson junction, capacitor, inductor, or resonator.
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