Interconnect structures for assembly of semiconductor structures including superconducting integrated circuits
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United States of America Patent
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Aug 27, 2019
Grant Date -
Jan 11, 2018
app pub date -
Nov 3, 2016
filing date -
Nov 5, 2015
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Abstract
A multi-layer semiconductor structure includes a first semiconductor structure and a second semiconductor structure, with at least one of the first and second semiconductor structures provided as a superconducting semiconductor structure. The multi-layer semiconductor structure also includes one or more interconnect structures. Each of the interconnect structures is disposed between the first and second semiconductor structures and coupled to respective ones of interconnect pads provided on the first and second semiconductor structures. Additionally, each of the interconnect structures includes a plurality of interconnect sections. At least one of the interconnect sections includes at least one superconducting and/or a partially superconducting material.
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