Semiconductor device and method of manufacturing the same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Feb 19, 2019
Grant Date -
Jan 11, 2018
app pub date -
Sep 21, 2017
filing date -
Feb 23, 2016
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Disclosed is a method of manufacturing a semiconductor device, including: forming a stacked structure including first material layers and second material layers alternately stacked on each other; forming a pillar passing through the stacked structure, the pillar including a protruding portion protruding above an uppermost surface of the stacked structure; forming a conductive layer surrounding the protruding portion of the pillar; and forming a conductive pattern in contact with the protruding portion of the pillar by oxidizing a surface of the conductive layer.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully