Semiconductor device and method of manufacturing the same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
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May 29, 2018
Issued Date -
N/A
app pub date -
Apr 27, 2017
filing date -
Jul 8, 2016
priority date (Note) -
In Force
status (Latency Note)
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Abstract
An improvement is achieved in the reliability of a semiconductor device. In a memory cell region, a plurality of fins are provided which are portions of a semiconductor substrate extending in an x-direction along a main surface of the semiconductor substrate and spaced apart from each other in a y-direction orthogonal to the x-direction along the main surface of the semiconductor substrate. Between the fins adjacent to each other in the y-direction, a portion of an upper surface of an isolation region is at a position higher than a surface obtained by connecting a position of the upper surface of the isolation region which is in contact with a side wall of one of the fins to a position of the upper surface of the isolation region which is in contact with a side wall of the other fin. In a cross section along the y-direction, the upper surface of the isolation region has a projecting shape.
First Claim
all claims..Other Claims data not available
Family
Country | kind | publication No. | Filing Date | Type | Sub-Type |
---|---|---|---|---|---|
JP | B2 | JP6688698 | Jul 08, 2016 | Patent | Grant |
Type : Patent Sub-Type : Grant | |||||
PUBLISHED GRANTED PATENT (SECOND LEVEL) | 半導体装置およびその製造方法 | Apr 28, 2020 | |||
CN | B | CN107591449 | Jun 21, 2017 | Patent | Grant |
Type : Patent Sub-Type : Grant | |||||
GRANTED PATENT FOR INVENTION | Semiconductor device and method for manufacturing the same | May 10, 2022 | |||
EP | A2 | EP3267471 | Jun 27, 2017 | Patent | Application |
Type : Patent Sub-Type : Application | |||||
APPLICATION PUBLISHED WITHOUT SEARCH REPORT | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | Jan 10, 2018 | |||
TW | B | TWI726125 | Jul 04, 2017 | Patent | Grant |
Type : Patent Sub-Type : Grant | |||||
GRANTED PATENT OR PATENT OF ADDITION | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | May 01, 2021 | |||
US | B2 | US10211216 | Apr 24, 2018 | Patent | Grant |
Type : Patent Sub-Type : Grant | |||||
GRANTED PATENT AS SECOND PUBLICATION | Semiconductor device and method of manufacturing the same | Feb 19, 2019 | |||
US | B2 | US10483275 | Jan 09, 2019 | Patent | Grant |
Type : Patent Sub-Type : Grant | |||||
GRANTED PATENT AS SECOND PUBLICATION | Semiconductor device and method of manufacturing the same | Nov 19, 2019 |
- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
RENESAS ELECTRONICS CORPORATION | TOKYO |
International Classification(s)

- 2017 Application Filing Year
- H01L Class
- 30754 Applications Filed
- 25260 Patents Issued To-Date
- 82.14 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Tsuda, Shibun | Tokyo, JP | 15 | 29 |
# of filed Patents : 15 Total Citations : 29 |
Cited Art Landscape
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Patent Citation Ranking
- 1 Citation Count
- H01L Class
- 23.71 % this patent is cited more than
- 7 Age
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Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
---|---|---|---|---|
7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Nov 29, 2025 |
11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Nov 29, 2029 |
Fee | Large entity fee | small entity fee | micro entity fee |
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Surcharge - 7.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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