Thinning process using metal-assisted chemical etching
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United States of America Patent
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Feb 13, 2018
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app pub date -
Jul 8, 2016
filing date -
Jul 8, 2016
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Abstract
Methods for forming a chip package are provided. The method includes providing at least one carrier substrate including first semiconductor dies mounted thereon. The method also includes forming a first noble metal layer including nanopores irregularly distributed therein to cover each one of the first semiconductor dies. The method further includes immersing the carrier substrate with the first semiconductor dies into an etchant solution including a fluoride etchant and an oxidizing agent, so that each one of the first semiconductor dies covered by the first noble metal layer is thinned.
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