Enhanced power distribution to application specific integrated circuits (ASICS)

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United States of America Patent

PATENT NO 10096582
APP PUB NO 20180012879A1
SERIAL NO

15205702

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Abstract

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Presented herein is a method and apparatus for enhanced power distribution to application specific integrated circuits (ASICs). The apparatus includes a substrate, an ASIC, and a voltage regulator module. The substrate includes a first side, a second side, and a vertical interconnect access (via) extending between the first side and the second side. The ASIC is mounted on the first side of the substrate in alignment with the via. The voltage regulator module is mounted on the second side of the substrate in alignment with the via so that the voltage regulator module is electrically coupled to the ASIC through the via.

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Patent Owner(s)

Patent OwnerAddress
CISCO TECHNOLOGY INC170 WEST TASMAN DRIVE SAN JOSE CA 95134

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Argyrakis, Straty San Jose, US 4 17
Mantiply, Paul L Mountain View, US 3 17

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