Communicating optical signals between stacked dies
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United States of America Patent
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May 7, 2019
Grant Date -
Jan 11, 2018
app pub date -
Sep 22, 2017
filing date -
Jul 20, 2015
priority date (Note) -
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Abstract
A method includes forming a stack of semiconductor die. The stack includes a first semiconductor die, a second semiconductor die and a third semiconductor die. The first semiconductor die is stacked above the second semiconductor die and the third semiconductor die is stacked above the first semiconductor die. A first optical transmitter and a first optical receiver are provided in the first semiconductor die, a second optical transmitter is provided in the second semiconductor die, and a second optical receiver is provided in the third semiconductor die. A first optical signal is transmitted from the first optical transmitter in the first semiconductor die to the second optical receiver in the third semiconductor die. A second optical signal is transmitted from the second optical transmitter in the second semiconductor die to the first optical receiver in the first semiconductor die.
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