MOLDED LED PACKAGE WITH LAMINATED LEADFRAME AND METHOD OF MAKING THEREOF
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United States of America Patent
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Jul 5, 2017
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Jul 6, 2016
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Abstract
A method of packaging light emitting diodes (LEDs) includes molding a lead frame containing a plurality of lead frame fingers that are parallel to each other such that the lead frame fingers are separated from each other by a molded insulating structure to form a molded lead frame, mounting light emitting diodes to at least a portion of the molded lead frame, and dicing the molded lead frame to form a plurality of lead-containing mounting structures. Each of the lead-containing mounting structure includes a respective plurality of leads that are remaining portions of the lead frame, and each of the plurality of leads contains at least one castellation.
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