Three-dimensional stacking structure
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United States of America Patent
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Sep 15, 2020
Grant Date -
Jan 11, 2018
app pub date -
Aug 25, 2017
filing date -
May 26, 2016
priority date (Note) -
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status (Latency Note)
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Abstract
A three-dimensional stacking structure is described. The stacking structure includes at least a bottom die, a top die and a spacer protective structure. The bottom die includes contact pads in the non-bonding region. The top die is stacked on the bottom die without covering the contact pads of the bottom die and the bottom die is bonded with the top die through bonding structures there-between. The spacer protective structure is disposed on the bottom die and covers the top die to protect the top die. By forming an anti-bonding layer before stacking the top dies to the bottom dies, the top die can be partially removed to expose the contact pads of the bottom die for further connection.
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