Semiconductor memory package including stacked layers and memory device and semiconductor memory system having the same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
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Oct 9, 2018
Grant Date -
Jan 11, 2018
app pub date -
Jun 14, 2017
filing date -
Jul 8, 2016
priority date (Note) -
In Force
status (Latency Note)
Importance
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US Family Size
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Non-US Coverage
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Abstract
A semiconductor memory package includes a base layer that communicates with a memory controller; at least one memory layer that is stacked on the base layer; and at least one through silicon via that penetrates through the at least one memory layer, wherein at least one signal bump for exchanging a signal with the memory controller is disposed in a first area of the base layer located to be adjacent to the memory controller, and wherein the first area corresponds to an edge area of the base layer, and a power bump for receiving power from outside of the semiconductor memory package for performing a signal processing operation on the signal is disposed in a second area of the base layer contacting the at least one through silicon via, wherein the second area corresponds to an area other than edge areas of the base layer.
First Claim
Other Claims data not available
Family
| Country | kind | publication No. | Filing Date |
|---|---|---|---|
| KR | A | KR20180006229 | Jul 08, 2016 |
| CN | B | CN107591174 | Jul 07, 2017 |
International Classification(s)
- 2017 Application Filing Year
- H01L Class
- 30754 Applications Filed
- 25260 Patents Issued To-Date
- 82.14 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 6 Citation Count
- H01L Class
- 23.71 % this patent is cited more than
- 7 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Apr 9, 2026 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Apr 9, 2030 |
