Semiconductor memory package including stacked layers and memory device and semiconductor memory system having the same
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United States of America Patent
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Oct 9, 2018
Grant Date -
Jan 11, 2018
app pub date -
Jun 14, 2017
filing date -
Jul 8, 2016
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Abstract
A semiconductor memory package includes a base layer that communicates with a memory controller; at least one memory layer that is stacked on the base layer; and at least one through silicon via that penetrates through the at least one memory layer, wherein at least one signal bump for exchanging a signal with the memory controller is disposed in a first area of the base layer located to be adjacent to the memory controller, and wherein the first area corresponds to an edge area of the base layer, and a power bump for receiving power from outside of the semiconductor memory package for performing a signal processing operation on the signal is disposed in a second area of the base layer contacting the at least one through silicon via, wherein the second area corresponds to an area other than edge areas of the base layer.
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