Semiconductor package
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United States of America Patent
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Aug 7, 2018
Grant Date -
Jan 11, 2018
app pub date -
Feb 16, 2017
filing date -
Jul 6, 2016
priority date (Note) -
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Abstract
A semiconductor package includes a first semiconductor chip including a first through-silicon via (TSV), a second semiconductor chip stacked on the first semiconductor chip and including a second TSV, and a non-conductive film formed between the first semiconductor chip and the second semiconductor chip. The non-conductive film includes two layers having different viscosities.
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