Semiconductor package
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Aug 7, 2018
Grant Date -
Jan 11, 2018
app pub date -
Feb 16, 2017
filing date -
Jul 6, 2016
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A semiconductor package includes a first semiconductor chip including a first through-silicon via (TSV), a second semiconductor chip stacked on the first semiconductor chip and including a second TSV, and a non-conductive film formed between the first semiconductor chip and the second semiconductor chip. The non-conductive film includes two layers having different viscosities.
First Claim
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International Classification(s)
- 2017 Application Filing Year
- H01L Class
- 30754 Applications Filed
- 25260 Patents Issued To-Date
- 82.14 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- H01L Class
- 0 % this patent is cited more than
- 7 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Feb 7, 2026 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Feb 7, 2030 |
