THERMAL TRANSFER STRUCTURES FOR SEMICONDUCTOR DIE ASSEMBLIES
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United States of America Patent
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Issued Date -
Jan 11, 2018
app pub date -
Jul 6, 2016
filing date -
Jul 6, 2016
priority date (Note) -
Published
status (Latency Note)
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Abstract
Several embodiments of the present technology are described with reference to a semiconductor die assembly and processes for manufacturing the assembly. In some embodiments of the present technology, a semiconductor die assembly includes a stack of semiconductor dies attached to a thermal transfer structure (also known as a “heat spreader,” “lid,” or “thermal lid”). The thermal transfer structure conducts heat away from the stack of semiconductor dies. Additionally, the assembly can include molded walls fabricated with molding material to support the thermal transfer structure.
First Claim
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