Package assembly
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United States of America Patent
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Jan 29, 2019
Grant Date -
Jan 11, 2018
app pub date -
Sep 22, 2017
filing date -
Jan 24, 2012
priority date (Note) -
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status (Latency Note)
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Abstract
In some embodiments, the present disclosure relates to a package assembly having a bump on a first substrate. A molding compound is on the first substrate and contacts sidewalls of the bump. A no-flow underfill layer is on a conductive region of a second substrate. The no-flow underfill layer and the conductive region contact the bump. A mask layer is arranged on the second substrate and laterally surrounds the no-flow underfill layer. The no-flow underfill layer contacts the substrate between the conductive region and the mask layer.
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