Semiconductor package having a solder-on-pad structure
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United States of America Patent
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May 15, 2018
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app pub date -
Jul 5, 2016
filing date -
Jul 5, 2016
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Abstract
A semiconductor package and methods for producing the same are described. One example of the semiconductor package is described to include a substrate having a first face and an opposing second face. The package is further described to include a plurality of pads disposed on the first face of the substrate, each of the plurality of pads including a first face and an opposing second face that is in contact with the first face of the substrate. The semiconductor package is further described to include a plurality of solder-on-pad structures provided on a first of the plurality of pads.
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