Package structure with dummy feature in passivation layer
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United States of America Patent
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Dec 25, 2018
Grant Date -
Jan 11, 2018
app pub date -
Jul 8, 2016
filing date -
Jul 8, 2016
priority date (Note) -
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status (Latency Note)
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Abstract
Package structures are provided. The package structure includes an integrated circuit die. The package structure also includes a package layer surrounding the integrated circuit die. There is an interface between the integrated circuit die and the package layer. The package structure further includes a redistribution structure below the integrated circuit die and the package layer. The redistribution structure includes active conductive lines electrically connected to the integrated circuit die. The redistribution structure also includes a dummy conductive line between the active conductive lines. The dummy conductive line extends across the interface.
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