Coupling structures for signal communication and method of making same
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United States of America Patent
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Apr 17, 2018
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app pub date -
Jul 6, 2016
filing date -
Jul 6, 2016
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Abstract
Techniques and mechanism to provide signal communication with vias variously extending in a substrate. In an embodiment, a first capacitor and a second capacitor are coupled in parallel with one another each between a first via and a second via, the first via to receive a first signal. Respective portions of the first signal are concurrently communicated from the first via to the second via with the first capacitor and the second capacitor, respectively. In another embodiment, the first signal is one signal of a differential signal pair further comprising a second signal which is received at a third via. Respective portions of the second signal are concurrently communicated from the third via to a fourth via with a third capacitor and a fourth capacitor, respectively. The third capacitor and the fourth capacitor are coupled in parallel with one another each between the third via and the fourth via.
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