Semiconductor device with solders of different melting points and method of manufacturing
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United States of America Patent
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Apr 14, 2020
Grant Date -
Jan 11, 2018
app pub date -
Jul 6, 2017
filing date -
Jul 8, 2016
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Abstract
An aspect of the present disclosure provides a method of manufacturing a semiconductor device. The method includes: preparing a first semiconductor element and a second semiconductor element, each of the first semiconductor element and the second semiconductor element having an element main surface and an element back surface that face opposite sides to each other; die bonding the element back surface of the first semiconductor element to a pad main surface by using a first solder; and die bonding the element back surface of the second semiconductor element to the pad main surface by using a second solder having a melting point lower than a melting point of the first solder, after die bonding the element back surface of the first semiconductor element to the pad main surface by using the first solder.
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