Systems and methods to enhance passivation integrity

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10157810
APP PUB NO 20180012818A1
SERIAL NO

15714099

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Abstract

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Some embodiments relate to a semiconductor device. The semiconductor device includes a layer disposed over a substrate. A conductive body extends through the layer. A plurality of bar or pillar structures are spaced apart from one another and laterally surround the conductive body. The plurality of bar or pillar structures are generally concentric around the conductive body.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kuo, Kang-Min Zhubei, TW 58 187
Lai, Chen-Chung Guanxi Township, TW 20 59
Liao, Ying-Chieh Taipei, TW 81 664
Tien, Bor-Zen Hsinchu, TW 43 182
Yang, Han-Wei Hsinchu, TW 17 33

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