Circuit package

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10276468
APP PUB NO 20180012816A1
SERIAL NO

15544798

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Abstract

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A circuit package comprises a circuit device in a first epoxy mold compound and a second epoxy mold compound of different compositions.

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Patent Owner(s)

Patent OwnerAddress
HEWLETT-PACKARD DEVELOPMENT COMPANY L P10300 ENERGY DRIVE SPRING TX 77389

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Chien-Hua Corvallis, US 409 3027
Cumbie, Michael W Albany, US 272 997
Farrar, Stephen Albany, US 10 90

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