Semiconductor device package and methods of manufacture thereof
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United States of America Patent
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Nov 3, 2020
Grant Date -
Jan 11, 2018
app pub date -
Sep 20, 2017
filing date -
Mar 24, 2016
priority date (Note) -
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Abstract
A method of manufacturing a packaged semiconductor device includes forming an assembly by placing a semiconductor die over a substrate with a die attach material between the semiconductor die and the substrate. A conformal structure which includes a pressure transmissive material contacts at least a portion of a top surface of the semiconductor die. A pressure is applied to the conformal structure and in turn, the pressure is transmitted to the top surface of the semiconductor die by the pressure transmissive material. While the pressure is applied, concurrently encapsulating the assembly with a molding compound and exposing the assembly to a temperature that is sufficient to cause the die attach material to sinter.
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