Integrated antenna on interposer substrate
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United States of America Patent
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Dec 25, 2018
Grant Date -
Jan 11, 2018
app pub date -
Sep 20, 2017
filing date -
Feb 27, 2013
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Abstract
Some embodiments relate to a semiconductor module having an integrated antenna structure. The semiconductor module has an excitable element and a first ground plane disposed between a substrate and the excitable element. A second ground plane is separated from the first ground plane by the substrate. The second ground plane is coupled to the first ground plane by one or more through-substrate vias (TSVs) that extend through the substrate.
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