Integrated antenna on interposer substrate
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Dec 25, 2018
Grant Date -
Jan 11, 2018
app pub date -
Sep 20, 2017
filing date -
Feb 27, 2013
priority date (Note) -
In Force
status (Latency Note)
Importance
Calculated Rating
|
US Family Size
|
Non-US Coverage
|
Abstract
Some embodiments relate to a semiconductor module having an integrated antenna structure. The semiconductor module has an excitable element and a first ground plane disposed between a substrate and the excitable element. A second ground plane is separated from the first ground plane by the substrate. The second ground plane is coupled to the first ground plane by one or more through-substrate vias (TSVs) that extend through the substrate.
First Claim
Other Claims data not available
Family
+
−
| Country | kind | publication No. | Filing Date |
|---|---|---|---|
| US | B2 | US9779990 | Feb 27, 2013 |
| US | B2 | US10692763 | Dec 05, 2018 |
| US | B2 | US11075116 | Jun 19, 2020 |
| US | B2 | US11715668 | Jul 09, 2021 |
International Classification(s)
- 2017 Application Filing Year
- H01L Class
- 30754 Applications Filed
- 25260 Patents Issued To-Date
- 82.14 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- H01L Class
- 0 % this patent is cited more than
- 7 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Jun 25, 2026 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Jun 25, 2030 |
