INTERCONNECTS WITH INNER SACRIFICIAL SPACERS
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United States of America Patent
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app pub date -
Jul 6, 2016
filing date -
Jul 6, 2016
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Abandoned
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Abstract
Interconnect structures and methods of forming such interconnect structures. A spacer is formed inside an opening in a dielectric layer. After the spacer is formed, a conductive plug is formed inside the opening in the dielectric layer. After the conductive plug is formed, the spacer is removed to define an air gap located inside the opening in the dielectric layer. The air gap is located between the conductive plug and the opening in the dielectric layer.
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