Wafer-fixing tape, method of processing a semiconductor wafer, and semiconductor chip

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United States of America Patent

PATENT NO 10699933
APP PUB NO 20180012788A1
SERIAL NO

15702455

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Abstract

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A wafer-fixing tape, having: an temporary-adhesive layer provided on a substrate film, wherein the substrate film contains an ionomer resin comprising a terpolymer crosslinked by a metal ion, and wherein an arithmetic average roughness Ra of a surface of the substrate film opposite to the temporary-adhesive layer 5b is from 0.1 to 3.0 μm; a processing method of a semiconductor wafer; and a semiconductor chip.

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Patent Owner(s)

Patent OwnerAddress
FURUKAWA ELECTRIC CO LTDJAPAN TOKYO CHIYODA TOKYO TOKYO METROPOLIS

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Aoyama, Masami Tokyo, JP 19 90
Oka, Yoshifumi Tokyo, JP 12 95

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