Electrostatic chuck with features for preventing electrical arcing and light-up and improving process uniformity
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United States of America Patent
Stats
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Jul 20, 2021
Grant Date -
Jan 11, 2018
app pub date -
Jun 27, 2017
filing date -
Jul 7, 2016
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A substrate support for a substrate processing system includes a baseplate, a bond layer provided on the baseplate, and a ceramic layer arranged on the bond layer. The ceramic layer includes a first region and a second region located radially outward of the first region, the first region has a first thickness, the second region has a second thickness, and the first thickness is greater than the second thickness.
First Claim
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International Classification(s)
- 2017 Application Filing Year
- H01L Class
- 30754 Applications Filed
- 25260 Patents Issued To-Date
- 82.14 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 1 Citation Count
- H01L Class
- 52.76 % this patent is cited more than
- 4 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 3.5 Year Payment | $1600.00 | $800.00 | $400.00 | Jan 20, 2025 |
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Jan 20, 2029 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Jan 20, 2033 |
