Structure and formation method of semiconductor device structure

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United States of America Patent

PATENT NO 10872776
APP PUB NO 20180012769A1
SERIAL NO

15711542

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Abstract

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Structures and formation methods of a semiconductor device structure are provided. The semiconductor device structure includes a fin structure over a semiconductor substrate. The semiconductor device structure also includes a gate stack covering a portion of the fin structure. The semiconductor device structure further includes a spacer element over a sidewall of the gate stack. The spacer element includes a first layer and a second layer over the first layer. The dielectric constant of the first layer is greater than the dielectric constant of the second layer. A gate dielectric layer of the gate stack adjoins the first layer and the second layer.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Colinge, Jean-Pierre Hsinchu, TW 163 5338
Diaz, Carlos H Mountain View, US 267 4411

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