Plasma processing apparatus and plasma processing method

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United States of America Patent

PATENT NO 10672615
APP PUB NO 20180012768A1
SERIAL NO

15440043

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Abstract

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A plasma processing, apparatus of an embodiment includes a chamber, an introducing part, a first power source, a holder, an electrode, and a second power source. The introducing part introduces gas into the chamber. The first power source outputs a first voltage for generating ions from the gas. The holder holds a substrate. The electrode is opposite to the ions across the substrate, and has a surface not parallel to the substrate. The second power source applies a second voltage to the electrode. The second voltage has a frequency lower than the frequency of the first voltage and Introduces die ions to the substrate.

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Patent Owner(s)

Patent OwnerAddress
KIOXIA CORPORATION1-21 SHIBAURA 3-CHOME MINATO-KU TOKYO 108-0023

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Sakai, Itsuko Mie, JP 30 399
Sato, Yosuke Kanagawa, JP 185 1551
Ui, Akio Tokyo, JP 34 1012

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