DOPING METHOD, DOPING APPARATUS, AND SEMICONDUCTOR ELEMENT MANUFACTURING METHOD

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United States of America Patent

SERIAL NO

15539224

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Abstract

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Provided is a doping method for doping by injecting a dopant into a processing target substrate. According to this doping method, a value of bias electric power supplied during a plasma doping processing is set to a predetermined value on premise of a washing processing to be performed after a plasma doping, and plasma is generated within a processing vessel using microwaves so as to perform the plasma doping processing on the processing target substrate hold on a holding pedestal in the processing vessel.

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Patent Owner(s)

Patent OwnerAddress
TOKYO ELECTRON LIMITEDTOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
KOBAYASHI, Yuuki Miyagi, JP 23 163
OKA, Masahiro Yamanashi, JP 76 498
SUGIMOTO, Yasuhiro Yamanashi, JP 65 1060
UEDA, Hirokazu Yamanashi, JP 64 408

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