Electronic component
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United States of America Patent
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Jul 14, 2020
Grant Date -
Jan 11, 2018
app pub date -
Jun 2, 2017
filing date -
Jul 6, 2016
priority date (Note) -
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status (Latency Note)
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Abstract
An electronic component includes a body, a first inductor, and a low expansion portion. The body includes a laminated body including a plurality of insulating layers laminated in a lamination direction. The insulating layers contain a first resin as a material. The first inductor includes a first inductor conductor layer that adjoins one of the insulating layers. The low expansion portion has a coefficient of linear expansion lower than a coefficient of linear expansion of the plurality of insulating layers. The low expansion portion contains a second resin as a material. At least part of the low expansion portion is embedded in the laminated body. The second resin has a coefficient of linear expansion that is lower than a coefficient of linear expansion of the first resin.
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