Pattern Measurement Apparatus and Flaw Inspection Apparatus

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United States of America Patent

SERIAL NO

15545067

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Abstract

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The purpose of the present invention is to provide a pattern measurement apparatus that appropriately assesses patterns formed by patterning methods for forming patterns that do not exist on photomasks. In order to achieve this purpose, the present invention provides a pattern measurement apparatus comprising a processor that measures the dimensions of patterns formed on a sample by using data acquired by irradiating the sample with a beam, wherein the processor extracts pattern coordinate information on the basis of the data acquired by irradiating the sample with a beam, and uses the coordinate information to generate measurement reference data used when performing dimension measurements of the pattern.

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Patent Owner(s)

Patent OwnerAddress
HITACHI HIGH-TECH CORPORATION17-1 TORANOMON 1-CHOME MINATO-KU TOKYO 105-6409

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HIRAO, Kazuyuki Tokyo, JP 37 241
SAKAI, Kei Tokyo, JP 33 174
TAKASUGI, Yasunori Tokyo, JP 8 19
YAMAGUCHI, Satoru Tokyo, JP 96 1491

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