Method of designing layout of semiconductor device

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United States of America Patent

PATENT NO 10002223
SERIAL NO

15711390

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Abstract

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A method of designing a layout of a semiconductor device includes receiving information on a size of a target chip and a unit placement width for forming a gate line through a self-align double patterning process by a layout design system. The method also includes allocating an input and output area, a hard macro area, and a standard cell area at the target chip, and adjusting a width of the standard cell area by applying a gate generation rule for setting a width of at least one cell row located in the standard cell area to an odd number multiple of the unit placement width. The unit placement width corresponds to a width between centers of a pair of gate lines in the self-align double patterning process.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRONICS CO LTDGYEONGGI DO SOUTH KOREA GYEONGGI-DO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Jeong, Kwangok Hwaseong-si, KR 18 203

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