Method of forming conductive lines in circuits
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United States of America Patent
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Jul 23, 2019
Grant Date -
Jan 11, 2018
app pub date -
Sep 25, 2017
filing date -
May 19, 2014
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Abstract
A method of forming conductive lines in a circuit is disclosed. The method includes arranging a plurality of signal traces in a first set of signal traces and a second set of signal traces, fabricating, using a first mask, a first conductive line for a first signal trace of the first set of signal traces and fabricating, using a second mask, a second conductive line for a second signal trace of the second set of signal traces. Each signal trace of the first set of signal traces has a first width. Each signal trace of the second set of signal traces has a second width different from the first width. The arranging is based on at least a length of a signal trace of the plurality of signal traces.
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