RESIN, PHOTOSENSITIVE RESIN COMPOSITION, ELECTRONIC COMPONENT AND DISPLAY DEVICE USING THE SAME
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United States of America Patent
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Jan 25, 2016
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Jan 27, 2015
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Abstract
A resin having a small linear thermal expansion coefficient and a low absorbance is provided. The resin is characterized by including at least one structure selected from structures represented by the following general formulae (1) and (2):
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International Classification(s)
- H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
- C08G:MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN B....
- C07D:HETEROCYCLIC COMPOUNDS
- C07C:ACYCLIC OR CARBOCYCLIC COMPOUNDS
- G03F:PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNE....
- H05K:PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAIL....
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