Adhesive/sealing material for an electrowetting device
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United States of America Patent
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Nov 3, 2020
Grant Date -
Jan 11, 2018
app pub date -
Sep 22, 2017
filing date -
Feb 4, 2014
priority date (Note) -
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status (Latency Note)
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Abstract
Subject matter disclosed herein relates to improving a contact diameter of an adhesive/sealing material on surfaces of substrates by altering rheological properties of the adhesive/sealing material. An electrowetting display device comprises a first substrate and a second substrate, a first fluid and a second fluid disposed between the first substrate and the second substrate, wherein the first fluid is immiscible with the second fluid. An adhesive/sealing material comprising UV curable epoxy glue is in contact with the second fluid and couples the second substrate to the first substrate. The adhesive/sealing material further comprises silica particles in a range of 1-6% mass fraction of silica that alter rheological properties of the UV curable epoxy glue.
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International Classification(s)
- C09J:ADHESIVES; ADHESIVE PROCESSES IN GENERAL
- H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
- H01M:PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT....
- G09G:ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING....
- F16B:DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL E....
- G02B:OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
- G02F:DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF ....
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