Coating material for forming conductive release layer, method for producing same, conductive release film, and method for producing same
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United States of America Patent
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Dec 1, 2020
Grant Date -
Jan 11, 2018
app pub date -
Jul 6, 2017
filing date -
Jul 11, 2016
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Abstract
Provided is a coating material for forming a conductive release layer capable of forming a conductive release layer having high adhesion to a film base material, suppressing deterioration in conductivity over time in the air, and having a sufficient releasing property. The coating material for forming a conductive release layer of the present invention contains a conductive composite including a π-conjugated conductive polymer and a polyanion, an epoxy compound having an epoxy group, a curable silicone, a polyester resin, and an organic solvent.
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