Curable organosilicon resin composition
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United States of America Patent
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Jul 16, 2019
Grant Date -
Jan 11, 2018
app pub date -
May 30, 2017
filing date -
Jul 8, 2016
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Abstract
A curable organosilicon resin composition includes; (A) an organopolysiloxane having a resin structure containing 10 to 60 mol % of an R1SiO3/2 unit, 30 to 80 mol % of an (R2)2SiO2/2 unit, and 1 to 30 mol % of an (R3)3SiO1/2 unit. At least a part of the (R2)2SiO2/2 unit is in continuous repeating units with the average number of the repeating units being 3 to 80. The organopolysiloxane has a weight average molecular weight of 5,000 to 50,000; the amount of the hydroxy groups bonded to silicon atoms is 0.001 to 1.0 mol/100 g; and the amount of the alkoxy groups, each having 1 to 10 carbon atoms, bonded to silicon atoms is 1.0 mol/100 g or less. A curable organosilicon resin composition has excellent workability, can give a cured product rapidly, and can make the cured product excellent in mechanical properties, heat resistance, crack resistance, and adhesive property, the surface tackiness being suppressed.
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