DINADIC PHENYL AMINE REACTIVE ENDCAPS

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United States of America Patent

SERIAL NO

15653655

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Abstract

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Dinadic phenyl amine reactive endcap monomers for application in high-temperature polymeric composites are described. The amine group of the endcap is directly reacted with a desired chemical backbone to provide the preferred rigidity and chemical resistance. The ability of the amine group to react with a wide variety of chemical backbones allows the tailoring of formulations for various application temperatures, mechanical properties, processes and resistances while retaining the high degree of crosslinking that yields excellent temperature stability, ease of processing and the necessary toughness. Polyimide oligomers comprising the reaction product of at least one dinadic phenyl amine endcap monomer and a chemical backbone, preferably with a molecular weight not exceeding about 1000-3000, suitable for high temperature composites are described. The dinadic phenyl amine endcaps may be reacted with an acid anhydride capped precursor to form polyimide resins suitable for high-temperature composites.

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Patent Owner(s)

Patent OwnerAddress
THE BOEING COMPANY929 LONG BRIDGE DRIVE ARLINGTON VA 22202

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
LUBOWITZ, Hyman Ralph Rolling Hills Estates, US 5 21
TSOTSIS, Thomas Karl Santa Ana, US 33 274

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