Multi-layered nano-fibrous CMP pads
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United States of America Patent
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Oct 13, 2020
Grant Date -
Jan 11, 2018
app pub date -
Jan 29, 2016
filing date -
Jan 30, 2015
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Abstract
The present disclosure relates generally to a polishing article, and apparatus and methods of chemical mechanical polishing substrates using the polishing article. In some embodiments, the polishing article, such as a polishing pad, includes multiple layers in which one or more layers (i.e., at least the top layer) includes a plurality of nano-fibers that a positioned to contact a substrate during a polishing process. In one embodiment, a polishing article comprises a layer having a thickness less than about 0.032 inches, and the layer comprising fibers having a diameter of about 10 nanometers to about 200 micro meters.
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