Chemical mechanical polishing head

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10155297
APP PUB NO 20180009077A1
SERIAL NO

15205367

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Abstract

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To provide improved planarization, techniques in accordance with this disclosure include a CMP station that includes a support plate having a plurality of apertures. An aperture of the plurality of apertures has a first opening and a second opening connected by a slot. Other systems and methods are also disclosed.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Chunhung Youngjing, TW 18 17
Chen, Jerry Hsinchu County, TW 56 1799

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