FLEXIBLE BOARD AND PRODUCTION METHOD FOR METAL WIRING BONDING STRUCTURE

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United States of America Patent

SERIAL NO

15461861

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A connection FPC 75 includes a plurality of metal wires 750 between a support layer 751 and a covering layer 752, and an exposed region including contacts 753 serving as end portions of the metal wires 750 is exposed from the covering layer 752. A bending-position guide 760 is provided on the surface of the support layer 751 opposite from the surface on which the metal wires 750 are provided. An edge 760a of the bending-position guide 760 serves as a bending line along which the connection FPC 75 is bent and is disposed in a covering-layer projection area E where the covering layer 752 is projected on the support layer 751. The connection FPC 75 is bent at portions of the metal wires 750 covered with the covering layer 752, that is, at reinforced portions.

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Patent Owner(s)

Patent OwnerAddress
NGK INSULATORS LTD2-56 SUDA-CHO MIZUHO-KU NAGOYA-SHI AICHI-PREFECTURE 467-8530

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HIRATA, Natsuki Handa-City, JP 13 24
KIN, Rishun Handa-City, JP 8 28
TAKEBAYASHI, Hiroshi Handa-City, JP 103 140

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