Integrated module of acoustic wave device with active thermal compensation and an active thermal compensating method thereof

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United States of America Patent

PATENT NO 10756625
APP PUB NO 20180006633A1
SERIAL NO

15634481

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Abstract

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An integrated module of acoustic wave device with active thermal compensation comprises a substrate, an acoustic wave filter, an active adjustment circuit and at least one variable capacitance device. The acoustic wave filter comprises a plurality of series acoustic wave resonators formed on the substrate, at least one shunt acoustic wave resonator formed on the substrate and a thermal sensing acoustic wave resonator. Each of the variable capacitance device is connected in parallel to one of the series and shunt acoustic wave resonators. The active adjustment circuit outputs an active thermal compensation signal correlated to a thermal variation sensed by the thermal sensing acoustic wave resonator to the variable capacitance device. The active thermal compensation signal induces a capacitance variation of the variable capacitance device such that the impact of the thermal variation to the acoustic wave device is compensated.

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Patent Owner(s)

Patent OwnerAddress
WIN SEMICONDUCTORS CORPNO 69 KEJI 7TH RD GUISHAN DIST TAOYUAN CITY 33383

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chiang, Chih-Feng Tao Yuan, TW 9 20
Chou, Tung-Yao Tao Yuan, TW 3 7
Huang, Fan Hsiu Tao Yuan, TW 3 7
Lin, Cheng Kuo Tao Yuan, TW 5 12
Lin, Re Ching Tao Yuan, TW 7 37
Tsai, Shu Hsiao Tao Yuan, TW 3 7

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