SENSOR DEVICE AND METHOD FOR MANUFACTURING SAME

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United States of America Patent

SERIAL NO

15537699

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Abstract

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The present invention relates to a sensor device which has high S/N and excellent temperature characteristics. A sensor device has a semiconductor substrate, a first metal wiring layer provided on the semiconductor substrate, a first insulating layer provided on the first metal wiring layer, a compound semiconductor sensor element provided on the first insulating layer, a second metal wiring layer provided on the compound semiconductor sensor element and the first insulating layer, and a second insulating layer provided on the second metal wiring layer. A third insulating layer is provided between the first metal wiring layer and the second metal wiring layer, and the compound semiconductor sensor element is provided in the third insulating layer.

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Patent Owner(s)

Patent OwnerAddress
ASAHI KASEI MICRODEVICES CORPORATION1-1-2 YURAKUCHO CHIYODA-KU TOKYO 100-0006

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
NAKAMURA, Masahiro Tokyo, JP 238 2644

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