SIMULTANEOUS DOUBLE WIRE WEDGE BONDING METHOD, SYSTEM, KIT AND TOOL
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United States of America Patent
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Jun 30, 2016
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Jun 30, 2016
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Abstract
A wedge bonding method for simultaneously connecting two wires to a first component and then to a second component includes a) feeding the two wires side by side through a guide channel located at a lower end of a bonding wedge tool, b) positioning the bonding wedge tool over the first component and performing a first bond connection thereon, c) positioning the bonding wedge tool over the second component and performing a second bond connection thereon; and d) breaking tails of the two wires near the second bond connection.
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