Multi-axis flattening tool and method
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United States of America Patent
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Apr 14, 2020
Grant Date -
Jan 4, 2018
app pub date -
Jul 1, 2016
filing date -
Jul 1, 2016
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Abstract
A multi-axis flattening tool and method are described. In an example, the multi-axis flattening tool includes a support structure to constrain a bowed wafer along a support perimeter, and a pair of flattening structures independently movable relative to the support structure. For example, a first flattening structure may grip the wafer within the support perimeter and move axially relative to the support structure to bend the wafer about a first plane, and a second flattening structure may grip the wafer within the support perimeter and move axially relative to the support structure to bend the wafer about a second plane orthogonal to the first plane. The multi-axis bending of the wafer may flatten the wafer.
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