Laser weldable brackets for attachment of heat sinks to board level shields
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United States of America Patent
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Apr 14, 2020
Grant Date -
Dec 28, 2017
app pub date -
May 10, 2017
filing date -
Jun 23, 2016
priority date (Note) -
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status (Latency Note)
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Abstract
According to various aspects, exemplary embodiments are disclosed of laser weldable brackets for attachment of heat sinks to EMI shields, such as a board level shield, etc. In an exemplary embodiment, an assembly generally includes an electromagnetic interference (EMI) shield, a heat sink, and a bracket laser weldable to the EMI shield for attachment of the heat sink to the EMI shield. In another exemplary embodiment, a method of attaching a heat sink to an EMI generally includes laser welding a bracket to the EMI shield whereby the bracket retains the heat sink in place relative to the EMI shield.
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