SEMICONDUCTOR PACKAGE AND METHOD FOR PRODUCING SAME
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United States of America Patent
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app pub date -
May 3, 2017
filing date -
Jun 28, 2016
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Abstract
An object of the present invention is to provide a semiconductor package with which it is possible to reduce a volume of an encapsulation resin and to easily embed a resin regardless of thicknesses of semiconductor chips and a small distance between adjacent semiconductor chips, as well as to provide a thin semiconductor package with which a final product includes no support flat plate. To realize this, a semiconductor package having a structure wherein semiconductor chips are accommodated in cavity parts of a support which is formed by copper plating and includes the cavity parts is provided.
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