FILM FORMING APPARATUS, METHOD FOR MANUFACTURING FILM-FORMED PRODUCT, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
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United States of America Patent
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Dec 28, 2017
app pub date -
Jun 28, 2017
filing date -
Jun 28, 2016
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Abstract
A film forming apparatus includes a chamber that is a container in which a sputter gas is introduced, a carrying unit provided inside the chamber, and circulating and carrying a work-piece on a trajectory of a circular circumference, and a film formation processing unit including a sputter source depositing, on the work-piece circulated and carried by the carrying unit, a film formation material by sputtering to form a film, and a dividing member dividing a film forming position where the film is formed on the work-piece by the sputter source. The dividing member is installed so as to divide the film forming position in a way that, in the trajectory of the circular circumference, a trajectory of passing through a region other than the film forming position performing the film formation is longer than a trajectory of passing through the film forming position performing the film formation.
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