Thermoplastic Resin Composition and Electronic Device Housing Comprising Same
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Apr 22, 2016
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Apr 30, 2015
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A thermoplastic resin composition of the present invention includes a polycarbonate resin; a rubber-modified aromatic vinyl graft copolymer; a polyester resin; a glycol-modified polyester resin having about 10 mol % to about 60 mol % of a cyclohexanedimethanol (CHDM) content based on a total amount of a diol component; and a vinyl copolymer including an epoxy group. The thermoplastic resin composition has good impact resistance, flowability, external appearance and the like.
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