POLISHING APPARATUS, POLISHING METHOD AND POLISHING CONTROL PROGRAM
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United States of America Patent
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Dec 28, 2017
app pub date -
Jun 26, 2017
filing date -
Jun 28, 2016
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Abstract
A polishing unit polishes a semiconductor wafer. An eddy current sensor measures an eddy current variable according to variation of the film thickness of the semiconductor wafer at plural measurement times. A sensor processor calculates the film thickness of the semiconductor wafer at the measurement times based on the eddy current measured by the eddy current sensor. A film thickness estimating unit estimates film thicknesses after lapse of a processing delay time from the measurement times by using the calculated film thickness.
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